Application of Profilometric Measurements in an Assessment of Woven Fabrics Surface Geometry

ABSTRACT

The surface roughness of the textile materials is one of the crucial features influencing the appearance and functionality of fabrics and products made of them. The surface roughness of textile materials can be measured using the contact or non-contact methods. In the presented work, the non-contact method using the MicroSpy® Profile profilometer was applied to assess the quality of surface of the cotton woven fabrics of plain and 3/1S twill weave. Determination of surface geometry parameters and functions was done using the Mark III software according to the DIN EN ISO 4287 standard. Results showed that the twill woven fabric is characterized by greater roughness than the plain woven fabric. The profiles created along the warp and weft have different shapes dependably on fabric weave. The autocorrelation function reflects the weave pattern of the woven fabrics. Performed investigations confirmed that the non-contact method of measurement of fabric surface geometry by means of the profilometer provides very detailed and complex data about the fabrics’ surface quality.

摘要

纺织材料的表面粗糙度是影响织物及其制品外观和功能的关键特征之一. 纺织材料的表面粗糙度可以使用接触或非接触方法来测量. 在所介绍的工作中，使用MicroSpy®轮廓轮廓仪的非接触方法用于评估平纹和3/1S斜纹棉布织物的表面质量. 根据DIN EN ISO 4287标准，使用Mark III软件进行表面几何参数和功能的测定. 结果表明，与平纹织物相比，斜纹织物具有较大的粗糙度. 沿着经线和纬线形成的轮廓具有不同的形状，这取决于织物的组织. 自相关函数反映了机织物的编织图案. 所进行的研究证实，通过轮廓仪测量织物表面几何形状的非接触方法提供了关于织物表面质量的非常详细和复杂的数据.

KEYWORDS:

• Woven fabrics
• surface
• roughness
• measurement
• profilometer

关键词:

• 机织织物; 表面
• 粗糙度; 测量
• 轮廓仪

Highlights

• Application of innovative non-contact optical method of measurement of geometric structure of textile materials by means of the profilometer

• First such complex and systematic characterization of surface geometry of textile materials

• Showing the influence of weave on the surface geometry of cotton woven fabrics

• Confirming the usefulness of the profilometric measurements in an assessment a quality of surface of textile materials

Disclosure statement

No potential conflict of interest was reported by the author.