Synergistic effects of temperature and strain rate on tensile properties of simulated Ni-6Cu alloy with Σ3 non-Arrhenius grain boundary

ABSTRACT

Comprehending the mechanical response of materials on an atomic level is pivotal in the optimisation of advanced materials with superior mechanical properties. This research article utilises the atomistic-scale based molecular dynamics simulations to report the uniaxial tensile behaviour of bicrystalline Ni-6Cu (Nickel – 94% and Copper – 6%) alloy incorporated with pre-existing faceted Σ3 [111] 60° {11 8 5} grain boundaries. The primary aim of this investigation is to comprehend the performance of bicrystalline Ni-6Cu alloy under varying thermodynamic conditions and to assess the influence of pre-existing faceted grain boundaries on its tensile behaviour. This work encompasses a range of strain rates (10⁸ to 10¹⁰ 1/s) and temperatures (spanning from 100 to 900 K) for the uniaxial tensile deformation simulations. The outcomes unveil that the Young’s modulus of Ni-6Cu alloy (with pre-existing faceted grain boundaries embedded in its domain) was inversely proportional to temperature and constant with respect to strain rate. For the same configuration, yield stress was inversely and directly proportional to temperature and strain rate, respectively. Interestingly, incipient plasticity in the tensile stress–strain response was observed at lower temperature and lower strain rate. From the microstructural point of view, at lower temperatures, the incoherent twin boundary served as a source for the nucleation of stacking faults; however, as the temperature increased, both the incoherent twin boundary and the tips of coherent twin boundary function as the source for stacking faults formation. Our simulations also verified the GB’s anti-thermal (or non-Arrhenius) migration behaviour even under tensile load.

KEYWORDS:

• Faceted grain boundary
• molecular dynamics
• nickel-copper alloy
• tensile response
• cryogenic temperature

Disclosure statement

No potential conflict of interest was reported by the author(s).

Ethical approval

The authors hereby state that the present work is in compliance with the ethical standards.

Authors’ contributions

All the authors equally contributed to conceptualisation, methodology, writing, reviewing, and editing.

Additional information

Funding

Authors ‘Akarsh Verma’ and ‘Kriti’ acknowledges the support of SEED Grant provided by the K.R. Mangalam University, Gurugram, India.