Advancements in mechanical characterization techniques and environmental effects on bi-material interfaces in microelectronics: a literature review

ABSTRACT

Chip packaging engineering has evolved significantly to meet the performance demands of integrated circuits (IC) and micro-electromechanical systems (MEMS). Layers, mainly composed of metals, ceramics, and polymers are utilized to safeguard circuits and facilitate electrical connections. While, mechanical testing ensures bonding properties and reliability of bi-material interfaces in these components, there is a lack of discussion on the advantages and disadvantages of different test methods. Environmental factors, notably humidity and temperature, pose significant challenges, with a gap in understanding each condition’s impact on interfaces. This review aims to provide comprehensive insights into the mechanical characterization of bi-material interfaces and their response to environmental conditions. It’s divided into two main parts: a review of mechanical approaches in characterizing bi-material interfaces, including strength and quasi-static fracture tests and the presentation of test results considering temperature and humidity influence. The paper highlights the effects of humidity and high temperatures on the interface fracture energy, primarily due to the properties of polymeric materials in packaging for different interfaces. Additionally, it offers a summarized approach for selecting testing setups based on the desired interface.

KEYWORDS:

• Bi-material interface
• semiconductors
• reliability
• packaging
• delamination
• microelectronics
• epoxy mould compound
• silicon

Disclosure statement

No potential conflict of interest was reported by the author(s).