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Original Article
Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis
Akihiro Maesakaa Research Division 3, Sony Semiconductor Solutions Corporation, Atsugi, JapanCorrespondence[email protected]
, Yushin Kakeib Institute of Innovative Research, Tokyo Institute of Technology, Yokohama, Japan
, Tsutomu Osakaa Research Division 3, Sony Semiconductor Solutions Corporation, Atsugi, Japan
, Yoshihiro Kudoa Research Division 3, Sony Semiconductor Solutions Corporation, Atsugi, Japan
, Yu Sekiguchib Institute of Innovative Research, Tokyo Institute of Technology, Yokohama, Japan
& Chiaki Satob Institute of Innovative Research, Tokyo Institute of Technology, Yokohama, Japan
Received 19 Oct 2023, Accepted 19 Mar 2024, Published online: 26 Mar 2024
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