Advanced search
Publication Cover
The Journal of Adhesion Latest Articles
Submit an article Journal homepage
210
Views
0
CrossRef citations to date
0
Altmetric
Original Article

Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis

Akihiro Maesakaa Research Division 3, Sony Semiconductor Solutions Corporation, Atsugi, JapanCorrespondence[email protected]
,
Yushin Kakeib Institute of Innovative Research, Tokyo Institute of Technology, Yokohama, Japan
,
Tsutomu Osakaa Research Division 3, Sony Semiconductor Solutions Corporation, Atsugi, Japan
,
Yoshihiro Kudoa Research Division 3, Sony Semiconductor Solutions Corporation, Atsugi, Japan
,
Yu Sekiguchib Institute of Innovative Research, Tokyo Institute of Technology, Yokohama, Japan
&
Chiaki Satob Institute of Innovative Research, Tokyo Institute of Technology, Yokohama, Japan
Received 19 Oct 2023, Accepted 19 Mar 2024, Published online: 26 Mar 2024

Reprints and Permissions

This is an open access article distributed under the terms of the Creative Commons CC BY license, which permits unrestricted use, distribution, reproduction in any medium, provided the original work is properly cited.

You are not required to obtain permission to reuse this article in part or whole.

Related research

People also read lists articles that other readers of this article have read.

Recommended articles lists articles that we recommend and is powered by our AI driven recommendation engine.

Cited by lists all citing articles based on Crossref citations.
Articles with the Crossref icon will open in a new tab.