Performance Improvement of Z-Type Manifold Microchannel Heat Sink with Novel Fin-Arrangements

Abstract

The Z-type manifold microchannel heat sinks are mostly used by researchers due to the simple structure and considerable heat transfer performance. In this study, a novel Z-type manifold microchannel heat sink with fins arranged at intervals in an arithmetic sequence is proposed to improve the thermo-hydraulic performance of the conventional Z-type manifold microchannel. The novel feature of the proposed design is the channel widths being in an arithmetic sequence with a negative common difference, which contributes to equalize the flow distribution among the channels. Various fin arrangements with different common differences under the same heat transfer area are numerically investigated to determine the thermo-hydraulic performance. The results show that the fins arranged at intervals in an arithmetic sequence have a great potential in mitigating the flow maldistribution. Compared to the conventional manifold microchannel, the proposed manifold microchannel has better thermal performance without a significant increase in pressure drop.

Disclosure Statement

No potential conflict of interest was reported by the authors.

Additional information

Funding

This work was supported by the financial support from the GDAS’ Project of Science and Technology Development (2020GDASYL-20200302012, 2021GDASYL-20210103072).

Notes on contributors

Boqian Chen

Boqian Chen received her Ph.D. in fluid mechanics from the University of Science and Technology of China (2017). Currently, she is a postdoctoral fellow at the Institute of Semiconductors, Guangdong Academy of Sciences, China. Her current research interests are numerical research on thermal management of high-heat-flux electronic devices.

Chunyu Zhang

Chunyu Zhang is an associate research fellow in the Department of Modern Mechanics, University of Science and Technology of China. His research interests include compound drops, computational fluid dynamics, applied mathematics, mechanical engineering, fluid mechanics, and multiphase interfacial flow.

Yiqin Xu

Yiqin Xu is a deputy director of Packaging Application Platform, Institute of Semiconductors, Guangdong Academy of Sciences, China. His research interests include the third-generation semiconductor material epitaxy, package testing, optical design, visible light communication, spectral optimization design, and innovative lighting applications.

Zhitao Chen

Zhitao Chen serves as the president of Institute of Semiconductors, Guangdong Academy of Sciences, China. He has long been engaged in the development of wide bandgap semiconductor materials and device technology. His research interests include material growth, device technology, testing analysis, and device application.