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Methodology, Apparatus, Experimental Design
Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor
Jiaxin Zhoua Graduate School of Pure and Applied Sciences, University of Tsukuba, Tsukuba, Japan;b Center for Basic Research on Materials, National Institute for Materials Science, Tsukuba, Japanhttps://orcid.org/0000-0001-7681-1668
, Ikumu Watanabea Graduate School of Pure and Applied Sciences, University of Tsukuba, Tsukuba, Japan;b Center for Basic Research on Materials, National Institute for Materials Science, Tsukuba, JapanCorrespondence[email protected]
https://orcid.org/0000-0002-7693-1675
, https://orcid.org/0000-0002-7693-1675
Weikang Songa Graduate School of Pure and Applied Sciences, University of Tsukuba, Tsukuba, Japan;b Center for Basic Research on Materials, National Institute for Materials Science, Tsukuba, Japan
, Keita Kambayashic Department of Aerospace Engineering, Osaka Metropolitan University, Sakai, Osaka, Japanhttps://orcid.org/0009-0008-6439-1721
& Ta-Te Chenb Center for Basic Research on Materials, National Institute for Materials Science, Tsukuba, Japan;d Graduate School of Engineering, Nagoya University, Nagoya, Japanhttps://orcid.org/0000-0002-0553-4736
Article: 2320691
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Received 06 Oct 2023, Accepted 14 Feb 2024, Published online: 06 Mar 2024
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