References
- W. Nsengiyumva et al., Advances, limitations and prospects of nondestructive testing and evaluation of thick composites and sandwich structures: A state-of-the-art review. Compos. Struct. 256, (2021). DOI: 10.1016/j.compstruct.2020.112951.
- Z. Li et al., Res. Nondestr. Eval. 29(3), 123–142 (2017). DOI:10.1080/09349847.2016.1263772.
- N. Qaddoumi, A. Shroyer, and R. Zoughi, Res. Nondestr. Eval. 9 (4), 201–212 (1997). DOI: 10.1080/09349849709414474.
- Z. Liu and D. S. Forsyth, Res. Nondestr. Eval. 15 (1), 1–7 (2004). 10.1080/09349840490432650.
- S. De et al., IEEE Trans. Instrum. Meas. 62(4), 814–827 (2013). DOI:10.1109/TIM.2013.2240931.
- N. Ida and N. Meyendorf, eds. Handbook of Advanced Nondestructive Evaluation, (Springer International Publishing, Cham, Switzerland, 2019), Vol. 10. pp. 978–3.
- Z. Li et al., Compos. Part B. 161, 87–95 (2019). DOI: 10.1016/j.compositesb.2018.10.058.
- M. F. Imani et al., IEEE T. Antenn. Propag. 68(3), 1860–1875 (2020). DOI:10.1109/TAP.2020.2968795.
- S. Kharkovsky et al., IEEE Trans. Instrum. Meas. 57 (1), 168–175 (2008). DOI:10.1109/TIM.2007.909497.
- A. R. Haryono, M. Saif, and M. Abou-Khousa, 2018 IEEE international RF and microwave conference (RFM), Penang, Malaysia. 2018. DOI: 10.1109/RFM.2018.8846531
- B. Akuthota et al., J. Mater. Civ. Eng. 16 (6), 540–546 (2004). DOI:10.1061/(ASCE)0899-1561(2004)16:6(540).
- T. Liu, Z. Wang, and J. Hancock, Bioinformatics. 35 (21), 4222–4228 (2019). DOI: 10.1093/bioinformatics/btz251.
- T. M. Grzegorczyk et al., IEEE Trans. Med. Imaging. 31 (8), 1584–92 (2012). DOI:10.1109/TMI.2012.2197218.
- X. Shi et al., Sens. (Basel). 22 (5), 225 (2022). DOI:10.3390/s22052031.
- G. Govind et al., IEEE Sens. J. 18 (18), 7442–7449 (2018). DOI:10.1109/JSEN.2018.2859228.
- V. Khoshdel et al., Neural Comput. Appl. 33 (20), 13467–13479 (2021). DOI:10.1007/s00521-021-05970-3.
- X. Shi et al., Meas. 151, 151 (2020). DOI: 10.1016/j.measurement.2019.107243.
- N. H. M. M. Shrifan, M. F. Akbar, and N. A. Mat Isa, NDT & E Int. 119, (2021). DOI: 10.1016/j.ndteint.2021.102414.
- N. H. M. M. Shrifan et al., IEEE Access. 9, 4820–4828 (2021). DOI: 10.1109/ACCESS.2020.3048147.
- R. Zoughi, Microwave Non-Destructive Testing and Evaluation Principles (Springer Science & Business Media, Ft. Collins, Colorado, 2000), Vol. 4.
- B. Montpetit et al., Remote Sens. Environ. 162, 186–195(2015). DOI: 10.1016/j.rse.2015.02.015.
- A. Doerry et al., Microwave imaging using ultra-wideband noise waveforms for nondestructive testing of multilayer structures. Radar. Sens. Tech. XXII (2018), Vol. 10633, pp. 358–370. DOI: 10.1117/12.2305850
- M. D. Navagato and R. M. Narayanan, NDT & E Int. 104, 19–33 (2019). DOI: 10.1016/j.ndteint.2019.02.009.
- S. Balakrishnan et al., NDT & E Int. 51, 51–57 (2012). DOI: 10.1016/j.ndteint.2012.06.006.
- K. Gupta et al., AIP Conference Proceedings, Portland, Oregon. 2007. pp. 611–618 DOI: 10.1063/1.2718027.
- B. Khaleghi et al., Inf. Fusion. 14 (1), 28–44 (2013). DOI:10.1016/j.inffus.2011.08.001.
- S. Li, X. Kang, and J. Hu, IEEE Trans. Image Process. 22 (7), 2864–2875 (2013). DOI: 10.1109/TIP.2013.2244222.
- J. Zhou et al., Optik. 248, 248 (2021). DOI: 10.1016/j.ijleo.2021.168084.
- W. Fan, X. Li, and Z. Liu, Sci. Rep. 13 (1), 190 (2023). DOI: 10.1038/s41598-023-27391-z.
- X.-J. W. Hui Li and J. Kittler, 2018. Infrared and visible image fusion using a deep learning framework 24th international conference on pattern recognition (ICPR), 2705–2710. DOI: 10.1109/ICPR.2018.8546006.
- X. C. Lou and X. Feng, Comput. Math. Method. M. 2021, 1–16 (2021). DOI: 10.1155/2021/1544955.
- J. Ma et al., Inf. Fusion. 48, 11–26 (2019). DOI: 10.1016/j.inffus.2018.09.004.
- J. Gao et al., Neural Comput. 32 (5), 829–864 (2020). DOI:10.1162/neco_a_01273.
- Y. Liu et al., Inf. Fusion. 36, 191–207 (2017). DOI: 10.1016/j.inffus.2016.12.001.
- Y. Liu et al., Inf. Fusion. 42, 158–173 (2018). DOI: 10.1016/j.inffus.2017.10.007.
- L. Yan et al., IEEE Access. 8, 59976–59986 (2020). DOI: 10.1109/ACCESS.2020.2982712.
- Y. Wang et al., J. Intell. Fuzzy Syst. 42 (3), 2083–2102 (2022). DOI:10.3233/JIFS-211434.
- J. Park and W. Yu, Sens. (Basel). 21 (18), 6055 (2021). DOI: 10.3390/s21186055.
- T. Saba et al., Cogn. Syst. Res. 59, 221–230(2020). DOI: 10.1016/j.cogsys.2019.09.007.
- ImageNet. http://www.image-net.org.
- L. Ren et al., Infrared Phys. Technol. 114, 103662 (2021). DOI: 10.1016/j.infrared.2021.103662.
- K. He, J. Sun, and X. Tang, IEEE T. Pattern Anal. 35 (6), 1397–1409 (2012). DOI: 10.1109/TPAMI.2012.213.
- A. Toet, Pattern Recognit. Lett. 9 (4), 245–253 (1989). DOI: 10.1016/0167-8655(89)90003-2.
- P. Kovesi, J. Comp. Visi. Rese. 1 (3), 1–26 (1999).
- C. Tomasi and R. Manduchi, Sixth international conference on computer vision (IEEE Cat. No. 98CH36271), Mumbai, India. 1998.