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Research Article

Application of CNTs/H2O nanofluid and the wavy fin with dimples in thermal management of CPU: A numerical modeling of hybrid passive cooling

ORCID Icon, ORCID Icon, &
Received 27 Sep 2023, Accepted 29 Feb 2024, Published online: 23 Apr 2024

References

  • S. S. C. Ghadikolaei, “Solar photovoltaic cells performance improvement by cooling technology: an overall review,” Int. J. Hydrogen Energy, vol. 46, pp. 10939–10972, 2021. DOI: 10.1016/j.ijhydene.2020.12.164.
  • S. S. C. Ghadikolaei, “An enviroeconomic review of the solar PV cells cooling technology effect on the CO2 emission reduction,” Solar Energy, vol. 216, pp. 468–492, 2021. DOI: 10.1016/j.solener.2021.01.016.
  • K. Vafai and L. Zhu, “Analysis of two-layered micro-channel heat sink concept in electronic cooling,” Int. J. Heat Mass Transf., vol. 42, no. 12, pp. 2287–2297, 1999. DOI: 10.1016/S0017-9310(98)00017-9.
  • A. Khan, M. Z. Bellary, M. Ziaullah, and A. R. Kaladgi, “An experimental study on heat transfer enhancement of flat plates using dimples,” Am. J. Electr. Power Energy Syst., vol. 4, no. 4, pp. 34–38, 2015. DOI: 10.11648/j.epes.20150404.11.
  • P. Li, D. Zhang, Y. Xie, and G. Xie, “Flow structure and heat transfer of non-Newtonian fluids in microchannel heat sinks with dimples and protrusions,” Appl. Therm. Eng., vol. 94, pp. 50–58, 2016. DOI: 10.1016/j.applthermaleng.2015.10.119.
  • A. Mosavi et al., “Incorporation of horizontal fins into a PCM-based heat sink to enhance the safe operation time: applicable in electronic device cooling,” Appl. Sci., vol. 10, no. 18, p. 6308, 2020. DOI: 10.3390/app10186308.
  • S. U. S. Choi and J. A. Eastman, “Enhancing thermal conductivity of fluids with nanoparticles,” presented at the 1995 International Mechanical Engineering Congress and Exhibition, San Francisco, CA, USA, Nov. 12–17, 1995,
  • M. Bahiraei and A. Monavari, “Impact of nanoparticle shape on thermohydraulic performance of a nanofluid in an enhanced microchannel heat sink for utilization in cooling of electronic components,” Chin. J. Chem. Eng., vol. 40, pp. 36-47, 2021. DOI: 10.1016/j.cjche.2020.11.026.
  • Y.-Z. Ling, X.-S. Zhang, F. Wang, and X.-H. She, “Performance study of phase change materials coupled with three-dimensional oscillating heat pipes with different structures for electronic cooling,” Renew. Energy, vol. 154, pp. 636–649, 2020. DOI: 10.1016/j.renene.2020.03.008.
  • M. R. Shaeri, R. W. Bonner, and M. C. Ellis, “Thin hybrid capillary two-phase cooling system,” Int. Commun. Heat Mass Transf., vol. 112, p. 104490, 2020. DOI: 10.1016/j.icheatmasstransfer.2020.104490.
  • J. Kalizan and J. Tušek, “Caloric micro-cooling: numerical modeling and parametric investigation,” Energy Convers. Manag., vol. 225, pp. 113421, 2020. DOI: 10.1016/j.enconman.2020.113421.
  • M. Fattahi, H. Khakrah, M. Y. A. Jamalabadi, N. Bagheri, and D. Ross, “Cooling of an electronic package using lattice Boltzmann/finite volume method with experimental rheological/thermal analysis of hybrid nanofluid properties,” J. Mol. Liq., vol. 299, p. 112143, 2020. DOI: 10.1016/j.molliq.2019.112143.
  • D. Zhuang, Y. Yang, G. Ding, X. Du, and Z. Hu, “Optimization of microchannel heat sink with rhombus fractal-like units for electronic chip cooling,” Int. J. Refrig., vol. 116, pp. 108–118, 2020. DOI: 10.1016/j.ijrefrig.2020.03.026.
  • J. Huang, W. Sun, Z. Zhang, Z. Ling, and X. Fang, “Thermal protection of electronic devices based on thermochemical energy storage,” Appl. Therm. Eng., vol. 186, p. 116507, 2021. DOI: 10.1016/j.applthermaleng.2020.116507.
  • M. Bahiraei, N. Mazaheri, and M. R. Daneshyar, “Employing elliptical pin-fins and nanofluid within a heat sink for cooling of electronic chips regarding energy efficiency perspective,” Appl. Therm. Eng., vol. 183, p. 116159, 2021. DOI: 10.1016/j.applthermaleng.2020.116159.
  • H. Hassan and N. Y. Abdel Shafey, “3D study of convection-radiation heat transfer of electronic chip inside enclosure cooled by heat sink,” Int. J. Therm. Sci., vol. 159, p. 106585, 2021. DOI: 10.1016/j.ijthermalsci.2020.106585.
  • T. Brahim and A. Jemni, “CFD analysis of hotspots copper metal foam flat heat pipe for electronic cooling applications,” Int. J. Therm. Sci., vol. 159, p. 106583, 2021. DOI: 10.1016/j.ijthermalsci.2020.106583.
  • J. Yu, L. Chen, C. Qi, W. Zhang, and L. Liang, “Effects of shark bionic V-groove structures and nanofluids on thermal management of electronic components,” Colloids Surf. A: Physicochem. Eng. Asp., vol. 679, p. 132639, 2023. DOI: 10.1016/j.colsurfa.2023.132639.
  • C. Qi, J. Tang, F. Fan, and Y. Yan, “Effects of magnetic field on thermo-hydraulic behaviors of magnetic nanofluids in CPU cooling system,” Appl. Therm. Eng., vol. 179, p. 115717, 2020. DOI: 10.1016/j.applthermaleng.2020.115717.
  • H. M. Maghrabie et al., “Microchannel heat sinks with nanofluids for cooling electronic components: performance enhancement, challenges, and limitations,” Therm. Sci. Eng. Prog., vol. 37, p. 101608, 2023. DOI: 10.1016/j.tsep.2022.101608.
  • J. Wang et al., “Simulation of hybrid nanofluid flow within a microchannel heat sink considering porous media analyzing CPU stability,” J. Pet. Sci. Eng., vol. 208, p. 109734, 2022. DOI: 10.1016/j.petrol.2021.109734.
  • M. Bahiraei, S. Heshmatian, M. Goodarzi, and H. Moayedi, “CFD analysis of employing a novel ecofriendly nanofluid in a miniature pin fin heat sink for cooling of electronic components: effect of different configurations,” Adv. Powder Technol., vol. 30, no. 11, pp. 2503–2516, 2019. DOI: 10.1016/j.apt.2019.07.029.
  • T. Hayat, S. Ullah, M. I. Khan, and A. Alsaedi, “On framing potential features of SWCNTs and MWCNTs in mixed convective flow,” Results Phys., vol. 8, pp. 357–364, 2018. DOI: 10.1016/j.rinp.2017.12.017.
  • J. C. Maxwell, A Treatise on Electricity and Magnetism, 2nd ed. Cambridge, UK: Oxford Univ. Press, 1904, p. 435.
  • Q. Z. Xue, “Model for thermal conductivity of carbon nanotube-based composites,” Physica B: Condens. Matter, vol. 368, no. 1–4, pp. 302–307, 2005. DOI: 10.1016/j.physb.2005.07.024.
  • S. S. Ghadikolaei, M. Yassari, H. Sadeghi, K. Hosseinzadeh, and D. D. Ganji, “Investigation on thermophysical properties of TiO2–Cu/H2O hybrid nanofluid transport dependent on shape factor in MHD stagnation point flow,” Powder Technol., vol. 322, pp. 428–438, 2017. DOI: 10.1016/j.powtec.2017.09.006.
  • M. Khoshvaght-Aliabadi, S. M. Hassani, and S. H. Mazloumi, “Performance enhancement of straight and wavy miniature heat sinks using pin-fin interruptions and nanofluids,” Chem. Eng. Process., vol. 122, pp. 90–108, 2017. DOI: 10.1016/j.cep.2017.10.002.
  • B. Ramos-Alvarado, P. Li, H. Liu, and A. Hernandez-Guerrero, “CFD study of liquid-cooled heat sinks with microchannel flow field configurations for electronics, fuel cells, and concentrated solar cells,” Appl. Therm. Eng., vol. 31, no. 14-15, pp. 2494–2507, 2011. DOI: 10.1016/j.applthermaleng.2011.04.015.
  • M. Gorzin, A. A. Ranjbar, and M. J. Hosseini, “Experimental and numerical investigation on thermal and hydraulic performance of novel serpentine minichannel heat sink for liquid CPU cooling,” Energy Rep., vol. 8, pp. 3375–3385, 2022. DOI: 10.1016/j.egyr.2022.02.179.
  • S. E. Ghasemi, A. A. Ranjbar, and M. J. Hosseini, “Forced convective heat transfer of nanofluid as a coolant flowing through a heat sink: experimental and numerical study,” J. Mol. Liq., vol. 248, pp. 264–270, 2017. DOI: 10.1016/j.molliq.2017.10.062.
  • S. S. Ghadikolaei, S. Siahchehrehghadikolaei, M. Gholinia, and M. Rahimi, “A CFD modeling of heat transfer between CGNPs/H2O Eco-friendly nanofluid and the novel nature-based designs heat sink: hybrid passive techniques for CPU cooling,” Therm. Sci. Eng. Prog., vol. 37, p. 101604, 2023. DOI: 10.1016/j.tsep.2022.101604.
  • F. Harsij Sani, M. Pourfallah, and M. Gholinia, “The effect of MoS2–Ag/H2O hybrid nanofluid on improving the performance of a solar collector by placing wavy strips in the absorber tube,” Case Stud. Therm. Eng., vol. 30, p. 101760, 2022. DOI: 10.1016/j.csite.2022.101760.

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