- Auersperg , J. , Winkler , T. , Vogel , D. and Michel , B. Damage and fracture evaluation of microelectronic assemblies by FEA and experimental investigations . 2nd IEMT/IMC Symposium . Omiya, Tokyo.
- Dudek , R. , Scherzer , M. , Schubert , A. and Michel , B. 1998 . FE simulation for polymeric packaging materials . IEEE Transactions in Components, Packaging and Manufacturing Technology , A2 : 310
- Michel , B. Fracture electronics. Concepts of fracture mechanics for reliability estimation in microelectronics and microsystem technology . Proceedings of MicroMat '97 . Berlin. pp. 382 – 9 .
- Michel , B. Mechanical property measurements . Presented at the International Conference on Metallurgical Coatings and Thin Films . April 12-17 , San Diego, USA. pp. 93.131 (ICMCTF'99) Book of Abstracts
- Michel , B. , Dudek , R. and Schubert , A. Improvement of thermo-mechanical performance of advanced packages by experimentally assisted FEAnalysis . Proc. Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, (POLY'99) . Nov. 29 , Paris. Vol. 21 , pp. 87 – 94 . -Dec. 3; ASME EEP
- Winkler , T. , Schubert , A. , Kaulfersch , E. and Michel , B. 2000 . Consideration of parameter scattering in thermo-mechanical characterisation of advanced packages . ASME Journal of Electronic Packaging , in press : 122
Technology, Law and Insurance
Volume 5, 2000 - Issue 3-4